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Classes taught

• ENGR 202 Mechanics of Deformables
• EGRM 204 Thermodynamics

Education

• B.S. in Mechanical Engineering, Virginia Tech, Blacksburg, Va., 2003
• M.S. in Mechanical Engineering, Virginia Tech, Blacksburg, Va., 2004
• Ph.D. in Mechanical Engineering, Virginia Tech, Blacksburg, Va., 2007

Representative Publications

• H. Lohse-Busch, T. Stinchfield, Manu Mital, A. Hines, and D.J. Nelson, “Design and Implementation of a Hybrid Electric Vehicle Powered by a Hydrogen Engine” SAE Paper 2004-01-0194, 2004 SAE Congress, 3/8–3/11/2004, Detroit, Michigan.
• Nestor M. Martinez Toro, Jose O. Class Quinones, Nihad Dukhan, Ying-Feng Pang, Elaine P. Scott, Manu Mital, “Direct Comparison Between a Heat Sink and a Foam Block Cooling of a Computer Chip,” Center for Power Electronics Systems Annual Conference, April 2005.
• Andrew C. Baisden, Jing Xu, Qian Liu, Luis Arnedo, Manu Mital, Erik R. Olson, Joshua D. Kagerbauer, J. Daan van Wyk, Zhen Xian Liang, Dushan B. Boroyevich, Elaine P. Scott, Thomas M. Jahns, Robert D. Lorenz, “Multi-Disciplinary Design for an IGBT/SiC Diode Half-Bridge IPEM,” Center for Power Electronics Systems Annual Conference, April 2006.
• Manu Mital, M.Y. Zhao , Elaine P. Scott, and Rena Huang, “Thermal Design and Optimization of a Micro-channel Cooled Integrated Power Electronic Module,” AIAA-2006-3605, 9th AIAA/ASME Joint Thermophysics and Heat Transfer Conference, San Francisco, California, June 2006.
• Y.F. Pang, Manu Mital, and Elaine P. Scott, “Thermal Characterization of Multi-chip Module - Integrated Power Electronics Module,” TCPT-2006-095, submitted to the IEEE Transactions on Components and Packaging Technologies, September 2004.
• Manu Mital, Andrew C. Baisden, Elaine P. Scott, Dushan B. Boroyevich, J. Daan van Wyk, Zhen Xian Liang, “Integrated Design Methodology for an Embedded Power Electronic Module,” TCPT-2006–095, submitted to the IEEE Transactions on Components and Packaging Technologies, May 2006.
• Manu Mital, and Elaine P. Scott, “Thermal Detection of Embedded Tumors using Infrared Imaging,” Journal of Biomechanical Engineering, Vol. 129 (1), pp. 33–39, February 2007.

Research Topics

• Artificial intelligence
• Numerical optimization
• Finite element analysis (FEA)
• Computational fluid dynamics (CFD)
• Thermal management of electronic equipment
• Heat transfer